Swedish semiconductor innovator AlixLabs has raised €14.1 million in Series A funding to accelerate development of its Atomic Layer Etching Pitch Splitting (APS) technology.
The round was backed by Navigare Ventures, Industrifonden, FORWARD.one, STOAF, and Global Brain.
Transforming Nanostructure Fabrication
A spin-out from Lund University and led by CEO Jonas Sundqvist, the company develops processes that enable chip manufacturers to create sub-20 nm structures more efficiently. Its APS method splits nanostructures in a single etching step, offering a pathway to significantly lower energy use, reduce wafer costs, and simplify advanced semiconductor production.
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From Validation to Industrial Adoption
With APS entering customer beta testing in 2026 and early manufacturing rollout targeted for 2027, the Series A marks a pivotal transition. “This funding moves us from validation into true industrialisation,” Sundqvist said. “We’re preparing for large-scale adoption of a technology that can reshape how advanced chips are made.”
About AlixLabs
AlixLabs develops advanced semiconductor manufacturing technology designed to enable energy-efficient production of nanostructures below 20 nm. Its APS™ process allows chipmakers to push beyond the limits of traditional optical and electron-beam lithography while cutting costs and environmental impact.
