FLEXOO, a Heidelberg-based deep tech startup focused on physical AI sensor technology, has raised €11 million in a Series A round led by eCAPITAL and AUMOVIO.
The funding will support global expansion and the scaling of its flexible sensor platform, particularly for applications in battery storage, automotive systems, and industrial IoT environments.
What The Company Does
Founded in 2023 as a spin-off from InnovationLab GmbH, FLEXOO develops ultra-thin, flexible sensors designed to provide real-time physical data for AI-driven systems. The company positions its technology as a hardware data layer that enables accurate data capture from physical environments, which is essential for training and operating AI models in industrial and technical applications.
Its modular sensor platform can be integrated onto surfaces, components, or confined spaces, allowing continuous monitoring of physical parameters such as temperature, pressure, and system behaviour. By combining printed electronics with edge-based AI processing, the platform enables precise data collection and analysis directly at the source.
In addition to its core sensor technology, FLEXOO offers contract engineering and manufacturing services across printed electronics, including battery monitoring systems, foil heaters, printed antennas, flexible PCBs, and customised sensor solutions tailored to specific industrial use cases.
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Market Context / Industry Background
As AI adoption expands into industrial and physical environments, the availability of high-quality real-time data from hardware systems has become a critical bottleneck. While significant investment has been directed toward AI models and software infrastructure, comparatively less attention has been given to the physical sensing technologies required to generate reliable input data.
Industries such as automotive, energy storage, and advanced manufacturing increasingly require embedded sensor intelligence to support predictive maintenance, system optimisation, and safety monitoring. Flexible and printed electronics are gaining relevance in this context, as they allow sensors to be deployed in environments where traditional rigid hardware is impractical.
The convergence of AI, IoT, and advanced materials is also driving demand for scalable sensor platforms that can be deployed across large industrial infrastructures while maintaining cost efficiency and integration flexibility.
Founder / Investor Commentary
Founding CEO Dr Michael Kröger stated that ultra-thin, free-form sensor technologies are essential for bridging the gap between physical hardware systems and AI algorithms, emphasizing that accurate real-time physical data is a prerequisite for effective physical AI applications. He noted that the new investment will help scale the company’s patented technology in a market driven by increasing demand for sensor-enabled intelligence.
eCAPITAL Managing Partner Hannes Schill highlighted that while significant capital is flowing into AI model development, many systems still lack the physical data infrastructure required for reliable deployment. He pointed to FLEXOO’s validated platform stack, from research and development through to deployment, and its targeted market focus on large industrial sectors with clear demand for real-time sensor intelligence.
Growth Plans / Use Of Funds
The €11 million Series A funding will be used to expand international sales and customer support operations, secure larger supply contracts, and advance prototype development of the company’s next-generation physical AI platform. FLEXOO also plans to strengthen its intellectual property portfolio and further develop its dexterous sensing technologies.
Looking ahead, the company aims to deepen partnerships with strategic industrial players and scale deployment of its sensor solutions in battery systems, automotive components, and other high-value industrial applications where continuous physical monitoring is critical.
About FLEXOO
FLEXOO is a Heidelberg-based deep tech company specializing in printed electronics and flexible sensor technologies. Founded in 2023 as a spin-off from InnovationLab GmbH. The company develops scalable platforms combining ultra-thin sensors, edge AI, and advanced manufacturing to enable real-time physical data collection for industrial, automotive, and energy applications.
