Eindhoven-based semiconductor startup CoolSem Technologies has closed a pre-seed funding round to move its wafer-level thermal management technology from concept to validated engineering samples.
The round was led by High-Tech Gründerfonds, with participation from KBC Focus Fund NV, the Brabant Development Agency, and TTT Green Tech B.V. (SHIFT Invest).
The funding provides CoolSem Technologies with runway to validate its technology with early customers and prepare for broader industry adoption across advanced semiconductor markets.
Advancing wafer-level thermal innovation
The company will use the capital to advance its wafer-level thermal management solution, WaLTIS, toward engineering samples for RF, power, and photonics applications. The next phase includes customer validation, qualification activities, and the generation of real-world performance data.
CoolSem Technologies positions its approach as a response to growing thermal inefficiencies in modern chips, where heat dissipation increasingly limits performance, reliability, and energy efficiency.
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Addressing heat as a semiconductor bottleneck
As chip performance requirements rise, thermal management has become a central constraint in semiconductor design. CoolSem’s technology aims to reduce thermal resistance and mechanical stress while extending hardware lifespan and enabling more efficient use of scarce raw materials.
The company frames its solution as contributing to lower energy waste and more sustainable semiconductor manufacturing, supporting circular economy goals within the industry.
Investor perspectives on scalability and integration
Investors highlighted the compatibility of CoolSem’s technology with existing semiconductor and photonics value chains. The wafer-level approach is designed to integrate with minimal redesign, enabling faster experimentation and adoption at lower cost compared to more disruptive packaging changes.
Backers also pointed to the team’s deep technical expertise and the growing importance of thermal design as a differentiating factor in next-generation chips.
Building from Europe’s semiconductor hubs
Founded in 2025, CoolSem Technologies operates from Eindhoven and draws on semiconductor expertise across regions including Eindhoven, Leuven, and Aachen. The company plans to use the pre-seed funding to demonstrate the scalability and reliability of its technology as it moves toward industrial deployment.
CoolSem Technologies says the next phase will focus on execution, customer validation, and positioning its wafer-level thermal stack as a core building block for future high-performance semiconductor and photonic devices.
